MediaTek has introduced the Dimensity 1050 processor as its first chip to support mmWave 5G. That makes it also the first MediaTek chipset to feature both sub-6GHz and mmWave frequency. It is manufactured on a TSMC 6nm class node. The silicon die consists of a 2+6 core structure with a max clock speed of 2.5GHz. Rest, it also features Arm’s Mali-G710 graphics and
The company’s proprietary HyperEngine 5.0 for an enhanced GPU-display integration.
Alongside the Dimensity 1050, the Taiwanese chipmaker has also released the Dimensity 930 and Helio G99 chipsets. Let’s see what all the three chips have to offer.
MediaTek Dimensity 1050 Specs and FeaturesMediaTek has equipped the Dimensity 1050 with 2x Arm Cortex-A78 performance cores@ 2.5GHz and 6x Arm Cortex-A55 efficiency cores. The clock speed of the latter hasn’t been revealed.
The octa-core processor is made on a TSMC 6nm architecture. However, the real standout aspect of the new chip is its compatibility with both mmWave and sub-6GHz 5G radio bands. The company has apparently either got or working to get certifications to sell in markets like the US and Japan. It is expected to arrive within phones between July and September months of this year.
The processor also comes with support for up to FHD+ @ 144Hz display, up to 2x LPDDR5 RAM, UFS 3.1 storage, WiFi 6E, Bluetooth 5.0, Imagiq 760 ISP, up to 108MP primary camera, dual HDR videography, and 4CC/3CC carrier aggregation.
MediaTek Dimensity 930, Helio G99 Specs and FeaturesNext up, we have the Dimensity 930 that’s an upgrade over Dimensity 810. It comes with 2x Cortex A78@ 2.2GHz plus 6x Cortex A55@ 2.0GHz. It also sports Imagination GPU, 2CC carrier aggregation, 120Hz Full HD+ displays, and HDR10+ video with MiraVision HDR support, HyperEngine 3.0 Lite for a low latency gaming experience.
Finally, there’s the Helio G99 will be coming inside phones in Q2, 2022 with “more than 30 percent power savings for gaming compared to the Helio G96”.
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